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Derniers dépôts
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Jean Baptiste Doucet, S. Pelloquin, Alexandre Lauvergne, E Daran, Sylvain Auge. A UV-NIL resist developed for a transitional soft mold process and the subsequent dry etch transfer into hard materials. 43rd INTERNATIONAL CONFERENCE ON MICRO AND NANOENGINEERING, Sep 2017, Braga, PORTUGAL, Portugal. ⟨hal-04466513⟩